Runic launches four classification total eleven products meeting AEC-Q100 grade 1 and MSL1.

Amplifiers :?RS8557XF-Q1、RS8452XK-Q1、RS8454XP-Q1

Comparators:?LM2901XQ-Q1、LM2903XK-Q1

Level converters:?RS4T245XTQW16-Q1、RS1T45XC6-Q1、RS2T45VS8-Q1

Logic ICs :?RS1G14XC5-Q1、RS1G17XC5-Q1、RS1G32XF5-Q1

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Our products were performed and passed on a series of reliability tests - accelerated environment stress?tests, accelerated lifetime Simulation?tests,?package assembly integrity?tests,?die fabrication reliability?tests,?electrical verification?tests,?defect screening?tests to meet AEC-Q100 qualification.

RS4T245XTQW16-Q?designed for DHVQFN16?SWF（side-wettable flank）is the first IC?in China meeting automotive qualification.

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Benefits of QNF packaging:

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1. Excellent thermal performance

2. Small footprint (yields savings in PCB real estate)

3. Thin package

The defects of QFN

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There is no easily viewed for automotive application to solderable or exposed pins/terminals to determine whether or not the package successfully soldered on to the printed circuit board (PCB) for general QFN packaging; however, Runic ensures RS4T245XTQW16-Q?quality using AuPdNi?Etching dimple lead?to fulfill AOI visualization.

There are 16 products in Runic meeting AEC-Q100 Grade 1. Contact us for more information.